100% material declaration data sheet fgg860 PK113 (v1.2) september 22, 2006 ma terial declaration data sheet average weight: 10.904 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.1201 1.10% silicon 7440-21-3 100.00 0.1201 die attach material 0.012 0.11% silver 7440-22-4 75.00 0.009 resin trade secret 25.00 0.003 mold compound 0.4135 7.31% epoxy resins trade secret 26.00 0.207 sio2 60676-86-0 74.00 filler 0.590 laminate 0.7897 7.24% laminate trade secret 0.481 solder mask trade secret 0.168 copper 7440-50-8 metal layer 0.122 nickel 7440-02-0 metal layer 0.014 gold 7440-57-5 metal layer 0.005 heat sink 7.0645 64.79% copper 7440-50-8 97.50 6.888 iron 7439-89-6 2.35 0.166 phosphorus 7723-14-0 0.003 0.0002 zinc 7440-66-6 0.12 0.008 heat snk plating 0.3292 3.02% nickel 7440-05-0 100.00 0.3292 dam 0.0148 0.13% epoxy resin trade secret 100.00 0.0.148 bond wire 0.0236 0.22% gold 7440-57-5 100.00 0.0236 solder balls 1.752 16.07% tin 7440-31-5 95.50 1.67316 silver 7440-22-4 4.00 0.07008 copper 7440-50-8 0.50 0.00876 PK113 (v1.2) september 22, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? fgg860 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 3/27/06 1.0 initial release. 5/15/06 1.1 100% material declaration. 9/22/06 1.2 updated component descriptions. PK113 (v1.2) september 22, 2006
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